Improved process for the copper plating, with large thicknesses, of metal surfaces or surfaces are not metallic

• 1. 非金属表面化学镀铜的方法 [P] . 中国专利： CN104152880A . 2014-11-19
• 2. 一种用于无机非金属表面或金属表面的涂层材料 [P] . 中国专利： CN104673031B . 2017.02.01
• 3. Process for the metallic coating of metallic surfaces by electroless copper plating [P] . 德国专利： DE102011080745A1 . 2012-02-23

  机译： 通过化学镀铜对金属表面进行金属涂层的方法

• 4. Improved process for the deposition of metallic copper on a catalytically activated surface [P] . ES8306188A3 . 1983-05-01

  机译： 改进的在催化活化表面上沉积金属铜的方法

• 5. Improved process for the deposition of metallic copper on a catalytically activated surface [P] . ES8306188A3 . 1983-08-01

  机译： 改进的在催化活化表面上沉积金属铜的方法

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• 2. Surface Characterization of Metallic Particles in Printed Circuit Board Comminution Fines and the Processing Implication [J] . Iyiola Olatunji Ogunniyi ,M. K. G. Vermaak ,Dick Groot . 矿物质和材料特性和工程（英文） . 2012,第6期
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• 4. 金属热喷涂用于非金属表面金属化研究 [C] . 刘颖 . 中国机械工程学会第三届全国表面工程大会 . 1996
• 5. 非金属表面沉积铁膜工艺研究 [A] . 李林泽 . 2010