Process for the metallic coating of metallic surfaces by electroless copper plating

摘要

The invention relates to methods for treating a metallic surface of an object with an aqueous copper plating solution, with which a first copper plating solution, which is cyanide-free and free of strong reducing agent, is formed on clean metallic surfaces of the object or after pretreatment on cleaned metallic surfaces first copper layer or copper alloy layer is used as a currentless barrier layer and / or as a conductive layer, and the use of the articles produced by the method according to the invention.