the device дл  завальцовывани  шиновых compounds in the corners дерев нных  щиков

• 1. 低滚动阻力轮胎的胎面胶胶料以及采用该胎面胶的轮胎 [P] . 中国专利： CN101792545B . 2012.04.11
• 2. 低滚动阻力轮胎的胎面胶胶料以及采用该胎面胶的轮胎 [P] . 中国专利： CN101792545A . 2010-08-04
• 3. Hardenable sealing compound e.g. adhesive sealing compound, applying method for kitchen furniture, involves applying sealing compound in corner areas such that thickness of corner areas is larger than that of sections of frame sides [P] . ES2338291A1 . 2010-05-05

  机译： 可硬化的密封剂，例如用于厨房家具的粘合剂密封剂的涂覆方法，涉及在拐角区域涂覆密封剂，以使拐角区域的厚度大于框架侧面部分的厚度。

• 4. Being the corner sealing compound and the corner [P] . 日本专利： JP4070528B2 . 2008-04-02

  机译： 作为边角密封剂和边角

• 5. A corner connection of two profiles with the C-shaped connection by means of a corner to bind as well as an angular piece to provide the compound [P] . DK0452256T3 . 1993-11-22

  机译： 两个型材的角连接和C形连接，通过一个要绑定的角以及一个角形件来提供复合材料

• 1. Literature Review of the Use of Zinc and Zinc Compounds in Paper-Based Microfluidic Devices [J] . Amer Charbaji, Hojat Heidari-Bafroui, Constantine Anagnostopoulos, 矿物质和材料特性和工程（英文） . 2021,第003期
• 2. Reliability Model for Key Devices with Compound Preventive Warranty [J] . BAI Yong-sheng, LI Feng, LI Ji, 东华大学学报（英文版） . 2015,第001期
• 3. Session 7 Quantum electronics and compound semiconductor devices—High speed compound semiconductor devices and device physics [C] . Myers D.R. Electron Devices Meeting, 1984 International . -1
• 4. Studies on compound semiconductor ZnIn2Se4 thin film electronic devices. [D] . Dhruv, Dhananjay Kanjibhai. 2015
• 5. Which endotracheal tube location minimises the device‐related pressure ulcer risk: The centre or a corner of the mouth? [O] . Golan Amrani, Amit Gefen 2020
• 6. Wearable Assistive Devices for the Visually Challenged Student's Corner [O] . Srivatsan Srinivasan 2020
• 7. Nightmares with Mobile Devices are Just Around the Corner. IEEE Portable 2007 [R] . Derr, K. W. 2006

• 1. Preface to the Special Topic on Compound Semiconductor Materials and Devices on Si [J] . Huiyun Liu ,Yikai Su ,Chuanbo Li . 半导体学报：英文版 . 2019,第10期
• 2. Progress in Antimonide Based III-V Compound Semiconductors and Devices [J] . Chao Liu ,Yanbo Li ,Yiping Zeng . 工程（英文）（1947-3931） . 2010,第8期
• 3. A New One-dimensional Chain Compound Constructed by {Mo8O28} units via Corner-sharing [J] . 余雅琴 ,杨文斌 ,吴传德 . 结构化学 . 2005,第002期
• 4. 白炭黑ZC-120MP在全钢低滚动阻力轮胎胎面胶中的应用 [C] . 冉宇宁 ,佘腾龙 ,王丹 . “麒祥杯”第11届全国橡胶助剂生产和应用技术研讨会 . 2015
• 5. 抗湿滑低滚动阻力轮胎胎面胶的研究 [A] . 张利召 . 2021