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A process for producing a silicon - or germanium film on a silicon - and / or germanium under position by epitaxial growth

机译:通过外延生长在一定位置上在硅和/或锗上生产硅或锗膜的方法

摘要

PICT:0995543/C1/1 In a process of coating a semi-conductor substrate such as silicon with a layer of semi-conductor material such as silicon, the semi-conductor substrate is mounted at least 10 mms. from a semi-conductor source in an atmosphere of a halide of the semi-conductor at a pressure of 10-1 to 10-6 mms.-Hg and the substrate and source are heated so that the substrate is maintained at least 20 DEG C. below the source temperature. Preferably, the respective temperatures are 1000-1180 DEG C and 1200-1350 DEG C The halide is preferably the tetrachloride of silicon; mixed halides of the constituents may be used in the case of a binary semi-conductor. The halide is mixed with hydrogen and the atmosphere should contain at least 10% by volume of the halides. As shown in the Figure, a silicon substrate 10 is mounted in a reaction chamber 12 and supported above a pedestal 11 which acts as the semi-conductor source. Heating is effected by R.F. coil 27, hydrogen is supplied from 16, the tetrachloride from bulb 21 via cold store 26 and the system is evacuated to the required pressure.ALSO:PICT:0995543/C6-C7/1 In a process of coating a semi-conductor substrate such as silicon or germanium with a layer of semi-conductor material such as silicon or germanium, the semi-conductor substrate is mounted at least 10 mms. from a semi-conductor source in an atmosphere of a halide of the semi-conductor at a pressure of 10-1-10-6 mm.s-Hg. and the substrate and source are heated so that the substrate is maintained at least 20 DEG C. below the source temperature. With a silicon substrate and source the respective temperatures are 1000-1180 DEG C. and 1200-1350 DEG C. and in the case of germanium the substrate is at 400-680 DEG C. and the source at 700-900 DEG C. The halide is preferably the tetrachloride of silicon or germanium or mixed halides of the constituents may be used in the case of a binary semi-conductor. The halide is mixed with hydrogen and the atmosphere should contain at least 10% by volume of the halides. As shown in the Figure, a silicon or germanium substrate 10 is mounted in a reaction chamber 12 and supported above a pedestal 11 which acts as the semi-conductor source. Heating is effected by R.F. coil 27, hydrogen is supplied from 16, the tetrachloride from bulb 21 via cold store 26 and the system is evacuated to the required pressure.
机译:在用诸如硅的半导体材料层涂覆诸如硅的半导体衬底的过程中,将半导体衬底安装至少10mm。在半导体的卤化物气氛中在压力为10-1到10-6 mms.Hg的条件下从半导体源中提取-Hg,并加热衬底和源,以使衬底保持至少20℃。低于源温度。优选地,各自的温度为1000-1180℃和1200-1350℃。卤化物优选为硅的四氯化物;在二元半导体的情况下,可以使用成分的混合卤化物。卤化物与氢混合,并且大气应包含至少10体积%的卤化物。如图所示,将硅衬底10安装在反应室12中,并支撑在用作半导体源的基座11上方。加热由R.F.盘管27,从16供给氢气,通过冷库26从灯泡21供给四氯化碳,然后将系统抽空至所需压力.ALSO:在涂覆半导体的过程中在具有诸如硅或锗的半导体材料层的诸如硅或锗的衬底上,半导体衬底被安装至少10mm。半导体源在半导体卤化物气氛中在10-1-10-6 mm.s-Hg的压力下从半导体源中提取。加热衬底和源,以使衬底保持在源温度以下至少20℃。对于硅衬底和源,各自的温度为1000-1180℃和1200-1350℃,并且在锗的情况下,衬底为400-680℃,而源为700-900℃。卤化物优选是硅或锗的四氯化物,或者在二元半导体的情况下可以使用成分的混合卤化物。卤化物与氢混合,并且大气应包含至少10体积%的卤化物。如图所示,将硅或锗衬底10安装在反应室12中,并支撑在用作半导体源的基座11上方。加热由R.F.在盘管27中,从氢气16从灯泡21经由冷库26供应氢气,并将系统抽空至所需压力。

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