chemically reduktives dip to stromlosen capture of magnetisierbaren nickel cobalt layers

摘要

An electroless plating bath for depositing a nickel-cobalt-phosphorus alloy comprises, NiCl2 6H2O 11.5 to 22.5 g./l., CoCl2 6H2O 12.5 to 19 g./l., an alkaline hypophosphite, e.g. 14.9 g./l. of NaH2PO2, Na3 C6H5O7SH2O 50 g./l., NH4Cl 40 g./l., the solution having a pH of 5.8 to 6.4 which is adjusted by NH4OH. The substrate may be non-metallic or a metal, e.g. copper, which may be sensitized with an aluminium wire.