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chemically reduktives dip to stromlosen capture of magnetisierbaren nickel cobalt layers
chemically reduktives dip to stromlosen capture of magnetisierbaren nickel cobalt layers
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机译:化学还原浸镀以化学捕获可磁化镍钴层
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摘要
An electroless plating bath for depositing a nickel-cobalt-phosphorus alloy comprises, NiCl2 6H2O 11.5 to 22.5 g./l., CoCl2 6H2O 12.5 to 19 g./l., an alkaline hypophosphite, e.g. 14.9 g./l. of NaH2PO2, Na3 C6H5O7SH2O 50 g./l., NH4Cl 40 g./l., the solution having a pH of 5.8 to 6.4 which is adjusted by NH4OH. The substrate may be non-metallic or a metal, e.g. copper, which may be sensitized with an aluminium wire.
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机译:用于沉积镍-钴-磷合金的化学镀浴包括:NiCl2 6H2O 11.5至22.5 g./l。CoCl2 6H2O 12.5-19 g./l .;碱性次磷酸盐,例如14.9克/升NaH 2 PO 2,Na 3 C 6 H 5 O 7 SH 2 O 50克/升,NH 4 Cl 40克/升,该溶液的pH为5.8至6.4,并通过NH 4 OH调节。基板可以是非金属或金属,例如金属。铜,可以用铝线敏化。
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