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A method for producing a good warmth by means of gear of a semiconductor component to the inner wall of its housing
A method for producing a good warmth by means of gear of a semiconductor component to the inner wall of its housing
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机译:一种通过将半导体部件固定在其壳体的内壁上来产生良好的保暖性的方法
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969,483. Semi-conductor devices. TELEFUNKEN A.G. Sept. 30, 1960 [Sept. 30, 1959], No. 33608/60. Heading H1K. To improve the cooling of a semi-conductor device 5 attached to a plate 3, a foil 1 of plastically deformable material is placed across the top of the envelope 2 before the insertion of the device so that the foil is carried in with the device and forms a good heat-conducting layer between the plate 3 and the envelope. The foil may be indium or a tin-indium mixture and heat conductivity to the envelope may be further improved by heating the device so as to just melt the foil. The envelope is sealed to a base 7. The plate 3 may initially be soldered or welded in a heat conducting cylinder before insertion in the envelope or a plates-rod or hollow cylinder may be spot-welded to the end of the plate. The envelope may be of glass, metal or ceramic or the envelope may be of a different material from its base.
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