process for kaltfliesspressen parts wire and device for carrying out this process

• 1. 铸锭件电磁泵低压铸造工艺及零件电磁泵低压铸造工艺 [P] . 中国专利： CN109513900A . 2019-03-26
• 2. 单层管状零件增加强度的工艺及实施该工艺的装置 [P] . 中国专利： CN85101782A . 1987-01-10
• 3. CHUCK FOR WIRE CARRYING, WIRE PROCESSING DEVICE WITH THE SAME AND WIRE PROCESSING METHOD USING THE SAME [P] . 日本专利： JP2004095238A . 2004-03-25

  机译： 用于线夹的夹头，具有相同结构的电线处理装置以及使用相同结构的电线处理方法

• 4. Process for producing a spiral wire filament, in particular for reinforcing rubber or plastic articles, device for carrying out the process and wire filament produced by the process [P] . 德国专利： DE19535595C2 . 2000-12-07

  机译： 用于制造螺旋线丝的方法，特别是用于增强橡胶或塑料制品的螺旋线丝的方法，实施该方法的装置以及通过该方法制造的线丝

• 5. WIRE CARRYING DEVICE AND WIRE PROCESSING DEVICE USING THE SAME [P] . 日本专利： JP2013184815A . 2013-09-19

  机译： 电线承载装置和使用相同的电线处理装置

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• 4. Getting carried away: Understanding memory and consumer processing of perceived storytelling in advertisements. [D] . Harris, Mary Ann B. 2007
• 5. Understanding the densification process of Bi2Sr2CaCu2Ox round wires with overpressure processing and its effect on critical current density [O] . M. R. Matras, J. Jiang, D. C. Larbalestier, -1
• 6. A Practical Method for Predicting Gold-Wire Deformation in Transfer Molding Process of Semiconductor Devices. Part I: Analysis of a BGA Package having Gold Wires with Uniform Dimensions. [O] . Junichi Saeki, Isamu Yoshida, Hiroshi Houzouji 2000
• 7. Process for attaching molecular wires and devices to carbon nanotubes and compositions thereof [R] . 2008

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• 2. Effects of-Thermal Processing on Transparent Conducting Oxides （TCO） Used in Optoelectronic Devices [J] . Zakia Fekkai . 材料科学与工程：中英文B版 . 2013,第003期
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• 4. ZL112Y压铸铝合金半固态重熔工艺及摩托车零件的半固态压铸成形 [C] . 左宏志 ,刘昌明 ,邹茂华 . 第二届半固态金属加工技术研讨会 . 2002
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