method and device for processing or manipulation of wire or other biegsamem laenglichem material

• 1. 一种用于汽车钥匙检测的三维赫姆霍兹线圈夹具 [P] . 中国专利： CN211627630U . 2020-10-02
• 2. 一种用于矢量传感器校准功能的赫姆霍兹消声器 [P] . 中国专利： CN209418147U . 2019.09.20
• 3. method and device for processing or manipulation of wire or other biegsamem laenglichem material [P] . 法国专利： FR2021017A1 . 1970-07-17

  机译： 用于处理或操纵金属丝或其他比塞姆·朗格莱赫姆材料的方法和设备

• 4. method and device for processing a strip of biegsamem folienartigem material, and by this method, materialstreifen fabricated [P] . 瑞士专利： CH404514A . 1965-12-15

  机译： 的方法加工带状比格森folienartigem材料，并通过这种方法，制造材料

• 5. Method and device for processing or manipulation of wire or other flexible elongated material [P] . 德国专利： DE1952392A1 . 1970-04-23

  机译： 用于处理或操纵金属丝或其他柔性细长材料的方法和装置

• 1. Recent advances of Cu-based hole transport materials and their interface engineering concerning different processing methods in perovskite solar cells [J] . Tengling Ye, Xiaochen Sun, Xiaoru Zhang, 天然气化学（英文版） . 2021,第011期
• 2. Search condition of purification materials and their proper processing for the rapid infiltration method [J] . 中国地球化学学报（英文版） . 2006,第0z1期
• 3. SMART MATERIAL CONTROL WITHOUT WIRE LEADS OR ELECTRODES: NEW METHODS AND DEVICES [C] . John A. Main 1997 ASME design engineering technical conferences (DETC'97) . 1997
• 4. Advanced processing methods to introduce and preserve dipole orientation in organic electro-optic materials for next generation photonic devices. [D] . Huang, Su. 2012
• 5. High Frequency Sonoprocessing: A New Field of Cavitation‐Free Acoustic Materials Synthesis Processing and Manipulation [O] . Amgad R. Rezk, Heba Ahmed, Shwathy Ramesan, 2020
• 6. A Practical Method for Predicting Gold-Wire Deformation in Transfer Molding Process of Semiconductor Devices. Part I: Analysis of a BGA Package having Gold Wires with Uniform Dimensions. [O] . Junichi Saeki, Isamu Yoshida, Hiroshi Houzouji 2000
• 7. Development of Novel Processing Methods for Producing Bone Augmentation and Replacement Materials and Devices [R] . Campbell, A. A. , Armstrong, B. 1999

• 1. Effect of different processing methods for the hole transporting layer on the performance of double layer organic light-emitting devices [J] . SU0 Fan YUJun-sheng DENG Jing LOUShuang-ling JIANGYa-dong . 光电子快报：英文版 . 2007,第4期
• 2. Applications of Secondary Electron Composition Contrast Imaging Method in Microstructure Studies on Heterojunction Semiconductor Devices and Multilayer Materials [J] . 刘安生 ,邵贝羚 ,安生 . 稀有金属：英文版 . 1999,第2期
• 3. The Study of Method for Complex Processing Turgay Sub-Standard Aluminum-Containing Raw Materials [J] . G. Sarsenbay ,L. A. Myltykbaeva ,R. A. Abdulwalyev . 材料物理与化学进展（英文） . 2012,第4期
• 4. Ⅴ 桥梁工艺设备与材料柳州欧维姆（OVM）建筑机械有限公司简介 [C] . . 中国公路学会98年桥梁学术讨论会 . 1998
• 5. 赫姆霍兹共振测量体积及其用于西瓜内部空心检测的系统研究 [A] . 陈华瑞 . 2014