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Circuit board for electric circuits with projecting connection, and method for applying a layer on such a circuit board

机译:具有突出连接的电路的电路板以及在该电路板上施加层的方法

摘要

1,117,023. Bases for circuit modules; connecting pieces. ERIE RESISTOR Ltd. 5 Aug., 1966 [23 Aug., 1965], No. 36008/65. Heading H2E. [Also in Division B5] To avoid misalignment of the terminal connectors of electric circuit modules having flat substrates, each connector is formed from wire of semi-circular cross-section bent into U-form and a contact portion on the substrate 9 is soldered between the flat sides of the U, the remaining parts of the U being pressed together to form a circular cross-section terminal connector 11 which may be inserted in sockets in a printed circuit board or other base. The module may be encapsulated, after first spraying the substrate with a protective coating, by inserting the terminal connectors 11 in holes in a removable base 13 (Fig. 8) of a die 12 and compressing heated plastics moulding material in the die with a plunger 14 until the plastics has cured. Alternatively the module may be encapsulated by known dipping methods.
机译:1,117,023。电路模块的底座;连接件。 ERIE RESISTOR Ltd.,1966年8月5日[1965年8月23日],第36008/65号。标题H2E。 [也在B5部分中]为了避免具有平坦基板的电路模块的端子连接器的未对准,每个连接器由弯曲成U形的半圆形横截面的线形成,并且将基板9上的接触部分焊接在之间。在U的平坦侧面上,U的其余部分被压在一起以形成圆形横截面的端子连接器11,该端子连接器11可以插入印刷电路板或其他基座的插座中。通过先将端子连接器11插入模具12的可移动底座13(图8)中的孔中,并用柱塞压缩模具中加热的塑料成型材料,可以在首先喷涂保护性涂层的基板后封装模块14直到塑料固化。可替代地,可以通过已知的浸渍方法来封装模块。

著录项

  • 公开/公告号DE1515694B2

    专利类型

  • 公开/公告日1971-04-22

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE19651515694

  • 发明设计人

    申请日1965-11-20

  • 分类号H05K;

  • 国家 DE

  • 入库时间 2022-08-23 09:53:33

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