首页>
外国专利>
Rectifying metal-semiconductor junctions for thin- - film devices
Rectifying metal-semiconductor junctions for thin- - film devices
展开▼
机译:整流薄膜器件的金属-半导体结
展开▼
页面导航
摘要
著录项
相似文献
摘要
Method of producing a rectifying junction with a thin-film semiconductor component consists in forming a film of metal on an insulating substrate, applying the semiconductor over the metal and forming an ohmic contact on the semiconductor film. In the process for producing the component the rectifying contact and the semiconductor are given a common heat treatment.
展开▼