Electroless copper deposition - from plating baths contg added chlorides, esp for plating aluminium

摘要

A chloride of a Group IA and/or Group ILA element, pref. 0.001-0.09 mol/l NaCl, KCl and/or MgCl2, is added to the aq. soln. contg. an organic Cu salt, pref. Cu acetate, Cu tartrate and/or Cu citrate, which is contacted with the conducting or non-conducting surfaces to be Cu-plated by electroless method. Pref. ag. soln. contains added reducing agents, e.g. formalin, and stabilisers, e.g. NaCN, and opt. additives controlling deposition rate, e.g. NH4F.