COPPER PLATING BATH CONTAINING SUPERCRITICAL FLUID FOR ELECTROLESS PLATING AND METHOD FOR TREATING ELECTROLESS PLATING USING ITS BATH

摘要

A copper plating solution with supercritical fluid and an electroless plating method thereof are provided to decrease environmental pollution and to form a plating layer whose copper plating structure against a plastic film is dense and a plating condition is favorable. A copper plating solution with supercritical fluid includes copper salt, a surfactant, and the supercritical fluid. The solubility of the supercritical fluid is high, and metabolic speed and heat transfer speed thereof are rapid. The diffusion coefficient of the supercritical fluid is large. A material which is used as the supercritical fluid is gas with low molecular weight and relatively-low critical temperature. The material which is used as the supercritical fluid is not existed as the supercritical fluid when a plating process at high pressure is finished. An electroless plating method thereof includes a step of providing a plated body; a step of manufacturing the copper plating solution by mixing the supercritical fluid which is cooled quickly, with a mixture of a solvent, the copper salt, and additives; and a step of forming a copper-plated layer by using the copper plating solution which is manufactured under the high pressure and by electroless-plating the copper plating solution on the plated body.