Printed laminated circuits - by bonding separate circuit plates of metal coated, glass fibre reinforced epoxy resin

摘要

Partial building of printed laminated circuits is effected by (a) providing double, metal coated insulating films of glass fibre reinforced epoxy resin on both sides with an etch resistant pref. light sensitive epoxy or phenoxy resin ester, cover (b) simultaneously removing the etch reserve from both sides at accurately oppositely placed places, the metal coatings etching away the epoxy resin (pref. with conc H2SO4) and the glass fibres (pref. with HF) (c) filling the etched holes, with metal, initially by an electroless method and then by electrodeposition, so that an electric connection is effected between the two metal coatings, (d) etching the conductor scheme from the metal coatings (e) combining the foamed plates by intermediate adhesive films of epoxy resin to laminated circuit plate, and (f) forming the contacts for the electric connection of the individual double conductor faces in the conventional way.