首页> 外国专利> Laminated printed circuits contg. polycyanurate resin - and epoxy resin insulating compsns., esp. as glass fibre prepregs

Laminated printed circuits contg. polycyanurate resin - and epoxy resin insulating compsns., esp. as glass fibre prepregs

机译:层压印刷电路板续聚氰尿酸酯树脂-和环氧树脂绝缘组合物,特别是作为玻璃纤维预浸料

摘要

A laminated printed circuit plate, consisting of a number of superimposed printed circuit planes, is produced by insulating each layer with (A) a resin compsn. contg. a cyonacid ester resin, an epoxy resin with 2 oxirane rings, in amt. to give the required dielectric constant, and a catalyst or hardener, or (B) a prepeg. consisting of a glass fibre impregnated with compsn. Am or (C) a laminate prepd. by heating the prepreg. B under press. and heating a laminate of such plates under press. The laminate has properties, e.g. electrical and mechanical properties, and resistance to heat, chemicals and moisture, at least as good as those of laminates from epoxy-impregnated glass fibre fabrics.
机译:叠层印刷电路板由多个叠置的印刷电路板组成,是通过用(A)树脂复合材料绝缘每一层而制成的。续氰基酸酯树脂,环氧乙烷环> 2的环氧树脂。以获得所需的介电常数,以及催化剂或固化剂,或(B)预浸料。由浸渍有compsn的玻璃纤维组成。是(C)层压制品。通过加热预浸料。 B按下。并在压力下加热这种板的层压板。层压板具有例如电气和机械性能,以及耐热,耐化学腐蚀和耐湿性,至少与环氧浸渍玻璃纤维织物的层压板一样好。

著录项

  • 公开/公告号DE2442780B2

    专利类型

  • 公开/公告日1978-08-17

    原文格式PDF

  • 申请/专利权人 MITSUBISHI GAS CHEMICAL CO. INC. TOKIO;

    申请/专利号DE19742442780

  • 发明设计人 GAKU MORIO TOKIO;

    申请日1974-09-06

  • 分类号H05K3/36;

  • 国家 DE

  • 入库时间 2022-08-22 22:04:34

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