of working with waermeableitungsvorrichtung for semiconductor components

• 1. 半导体组件用冷却器的制造方法、半导体组件用冷却器、半导体组件和电驱动车辆 [P] . 中国专利： CN105308742B . 2018.04.03
• 2. 半导体组件用冷却器的制造方法、半导体组件用冷却器、半导体组件和电驱动车辆 [P] . 中国专利： CN105308742A . 2016-02-03
• 3. Electronic component e.g. semiconductor component has heat sink that is provided between attachment portions to produce working contact pressure [P] . 德国专利： DE102012106615A1 . 2014-01-23

  机译： 电子元件例如半导体组件具有散热器，散热器设置在连接部分之间以产生工作接触压力

• 4. Method and apparatus for moving a drive component using a working component formed by etching a semiconductor material [P] . 日本专利： JP2009529429A . 2009-08-20

  机译： 使用通过蚀刻半导体材料形成的工作部件来移动驱动部件的方法和设备

• 5. A resist composition containing a binder and a radiation-sensitive component for use in a fine working of semiconductors [P] . 德国专利： DE19944729A1 . 2000-03-23

  机译： 用于半导体精细加工的包含粘合剂和辐射敏感组分的抗蚀剂组合物

• 1. Static and modal analyzing for the working table components of a machining center in ANSYS [J] . XIA Lian, HU Chunyang, HAN Jiang 计算机辅助绘图设计与制造（英文版） . 2012,第002期
• 2. Static and modal analyzing for the working table components of a machining center in ANSYS [J] . XIA Lian, HU Chunyang, HAN Jiang 计算机辅助绘图．设计与制造：英文版 . 2012,第002期
• 3. Acceptor-acceptor-type conjugated polymer semiconductors [J] . Dunshuai Qu, Ting Qi, Hui Huang 天然气化学（英文版） . 2021,第008期
• 4. Acceptor-acceptor-type conjugated polymer semiconductors [J] . Dunshuai Qu, Ting Qi, Hui Huang 能源化学：英文版 . 2021,第008期
• 5. Fatigue Strength Evaluation on Tested Components with an All Run Out Population. Limitations and Recommendations for the Use of Joint Probability in Determining the Endurance Limit and Working Curve Allowables for Dynamic Components [C] . Robert E. Vaughan, Jung Hua Chang, Michael Daniel AHS International 62nd Annual Forum Proceedings vol.3: Vertical Flight: Leading through Innovation . 2006
• 6. Photonic crystal active and passive device components in III-V semiconductors. [D] . Sabarinathan, Jayshri. 2003
• 7. Semiconductor Quantum Dots as Components of Photoactive Supramolecular Architectures [O] . Dr. Marcello La Rosa, Emily H. Payne, Prof. Dr. Alberto Credi 2020
• 8. Prediction of power semiconductors devices reliability working in cyclic mode [O] . E.V. Kravchenko, G.V. Kuznetsov 2014
• 9. Glass, Plastic & Semiconductors: Packaging Techniques for Miniature Optoelectronic Components. [R] . Pocha, M. D., Garrett, H. E., Patel, R. R., 1999

• 1. QUALITY CONTROL OF SEMICONDUCTOR PACKAGING BASED ON PRINCIPAL COMPONENTS ANALYSIS [J] . . 中国机械工程学报 . 2007,第006期
• 2. 红外CCD探测器半导体制冷组件的研制 [C] . Yan Hao ,闫浩 ,Xu Yimin . 第十三届全国低温工程大会 . 2017
• 3. 直流断路器半导体组件IGBT关断暂态电压过冲影响因素研究 [A] . 王鑫 . 2019