APPARATUS AND METHOD FOR SELECTIVELY BACKLIGHTING PRINTED CIRCUIT BOARD PERFORATIONS TO ACCURATELY LOCATE ELECTRICAL COMPONENT LEADS THEREIN

摘要

A component locating apparatus, of the type arranged to selectively backlight different groups of component lead receiving perforations in a printed circuit board or harness wiring board, includes an improved backlighting apparatus with a multilayer board formed from a plurality of conductive layers, insulated from one another. A layer is provided for each group of perforations to be simultaneously backlighted, and the multilayer board has openings therethrough corresponding to and registerable with the perforations in the printed circuit board. Mounted in each opening is a light source element having an electrical contact arranged to contact the conductive layer which corresponds to the group of perforations which includes the perforation opposite that opening. A power source and switch complete a circuit through selected ones of the conductive layers and the light source elements in contact therewith, thus causing the light source elements to emit light and thereby backlight the respective groups of perforations.