Selective electroplating of noble metals on conductor boards - using masks to vary thickness of gold deposited on board

摘要

Electrolytic deposition of noble metals on conductor boards, in which increased deposits are obtd. in certain specified zones, subjects the electrolyte to strong circulation and uses masks with holes and tabs to ensure a thicker deposit in the required zones. The electrolyte is pref. circulated in a longitudinal direction past the cathode, anodes and masks so that the consistency of the electrolyte is not impaired. The pref. device uses masks, provided with holes and tabs, and located between the anodes and the conductor board forming the cathode in the cell. Esp. for deposition of gold on printed circuit boards, allowing thicker deposit to be obtd. in some regions, e.g. for contacts. Reduced use of gold and thus lower costs as a thicker deposit is only applied where necessary.