solder for soldering of titanium and its спла - world of warcraft

• 1. 无铅软钎料、无铅焊料球、使用了该无铅软钎料的焊料接头和具有该焊料接头的半导体电路 [P] . 中国专利： CN105189027B . 2018.06.29
• 2. 无铅软钎料、无铅焊料球、使用了该无铅软钎料的焊料接头和具有该焊料接头的半导体电路 [P] . 中国专利： CN105189027A . 2015-12-23
• 3. SOLDER FOR TITANIUM AND ITS ALLOWS SOLDERING AND METHOD FOR SOLDERING TITANIUM AND ITS ALLOYS [P] . 俄罗斯专利： RU2539286C1 . 2015-01-20

  机译： 钛及其允许的焊料的焊接以及钛及其合金的焊接方法

• 4. Method of soldering ceramic or difficult-to-wet metal material with higher shear strength and soldered joints ceramic / ceramic, ceramic / metal and metal / metal with titanium-free solder [P] . SK232020A3 . 2020-08-03

  机译： 焊接具有较高剪切强度的陶瓷或难于润湿的金属材料的方法以及采用无钛焊料的陶瓷/陶瓷，陶瓷/金属和金属/金属的焊接接头

• 5. Solder for soldering titanium and its alloys and brazing process titanium and its alloys [P] . 俄罗斯专利： RU2013128460A . 2014-12-27

  机译： 钎焊钛及其合金和钎焊工艺的钛及其合金

• 1. Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology [J] . HAN Zong-jie, XUE Song-bai, WANG Jian-xin, 中国有色金属学报（英文版） . 2008,第004期
• 2. ZnO whiskers growth on the surface of Sn9 Zn/Cu solder joints in concentrator silicon solar cells solder layer [J] . Zhang Liang, Yang Fan, Zhong Sujuan 高技术通讯（英文版） . 2017,第003期
• 3. Effects of rapid solidification process and 0.1Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints [J] . 赵国际, 光华, 盛光敏, 中南大学学报（英文版） . 2016,第008期
• 4. Enhanced thermal and smicrostructure properties of Sn-1.0Ag-0.7Cu based lead-free solder with Titanium Oxide addition [C] . Rita Mohd Said, Norainiza Saud, Norhayanti Mohd Nasir Electronic Packaging Interconnect Technology Symposium . 2020
• 5. A Study on Process, Strength and Microstructure Analysis of Low Temperature SnBi-Containing Solder Pastes Mixed with Lead-free Solder Balls [D] . Kannammal Palaniappan, Sakthi Cibi. 2016
• 6. Retentive Force of Glass-Ceramic Soldered Customized Zirconia Abutment Copings with Prefabricated Titanium Bases [O] . Jeremias Hey, Monika Kasaliyska, Andreas Kiesow, 2020
• 7. Effect on the wettability, hardness and shear strength properties of 3-nano Titanium Oxide (TiO2) added Sn-3.8Ag-0.7Cu (SAC)/Copper (Cu) solder joint [O] . Amares Singh, Rajkumar Durairaj 2018
• 8. SOLDERING OF COPPER-CLAD NIOBIUM-TITANIUM SUPERCONDUCTOR COMPOSITE [R] . A. J. Moorhead, J. J. Woodhouse, D. S. Easton 1977

• 1. Effects of rapid solidification process and 0.1Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints [J] . 赵国际12 ,文光华1 ,盛光敏1 . 中南大学学报 . 2016,第008期
• 2. Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-1Zn-0.3Ag lead-free solder [J] . Ming-jie Dong ,Zhi-ming Gao ,Yong-chang Liu . 矿物冶金与材料学报 . 2012,第011期
• 3. 银基钎料真空钎焊钛/钢接头组织与性能研究 [C] . YUAN Linlin ,元琳琳 ,LI Bin . 2017年中国贵金属论坛 . 2017
• 4. 用于碳/铜连接的复合焊料中增强相与Cu-Ti钎料的润湿性研究 [A] . 聂敦伟 . 2015