Heat pipe cooled semiconductor device - has unitary arrangement of semiconductor and evaporation surface free of boundary layer pressure

摘要

The device contains a power semiconductor with two parallel main surfaces and two thin, cup-shaped elements, whose outer bottom surfaces are each coupled to the semiconductor surfaces, this connection providing pressure-free boundary layer. The cup-shaped elements are of electrically and thermally conductive material. Along the outer walls of the cup-shaped elements is mounted a creep path extending device, having a thermal density of at least 3.5. W per surface sq.cm. One of the cup-shaped elements closes an open evaporation section end of a long heat tube, to which it is connected via high-pressure free members along its side wall part. The inner bottom surface of the element forms the evaporation surface in the heat tube.