Mounting assembly for thin- or thick-film circuit substrates - has two metal plates one soldered to substrate earth and other to support earth

摘要

The mounting assembly is intended for thin- or thick-film circuit substrates and consists of two metal plates (3, 4) each with central recesses in thier upper faces and with the lower plate (4) slightly larger than the upper one. The circuit substrate (2) has its ground plane soldered (9) to the ridges (5) on the top of the upper plate. The upper plate and substrate are seated in the support plate (1). The undersurface of the upper plate has a threaded shaft (7) that passes through the lower plate and allows a nut (8) to hold the two plates together. The lower plate ridges (6) are soldered (10) to the metallised undersurface of the support plate.