首页> 外国专利> Cooling for electronic components - involves using components embedded in heat conductive mass of metal powder in resin which has large heat transfer surface

Cooling for electronic components - involves using components embedded in heat conductive mass of metal powder in resin which has large heat transfer surface

机译:电子部件的冷却-涉及使用嵌入导热能力强的树脂中的金属粉末导热块中嵌入的部件

摘要

An electrical component especially one intended for mounting on a printed circuit board, generates heat in operation which has to be removed. The live parts of the component are given an insulating coating and the whole component is then embedded in a coolant mass of a conducting material which has a large surface areasuch as an artificial resin, impregnated with metal powder, especially iron powder. The coolang mass (18) may be cast with a set of cooling ribs (19).
机译:电气部件,特别是打算安装在印刷电路板上的电气部件,在运行中会产生热量,必须将其清除。给部件的带电部件提供绝缘涂层,然后将整个部件嵌入具有较大表面积的导电材料(例如人造树脂)的冷却剂块中,该材料浸渍有金属粉,尤其是铁粉。可以用一组冷却肋(19)来浇铸冷汤团(18)。

著录项

  • 公开/公告号DE2511010A1

    专利类型

  • 公开/公告日1976-09-23

    原文格式PDF

  • 申请/专利权人 ROBERT BOSCH GMBH;

    申请/专利号DE19752511010

  • 发明设计人 ZOEBLHARTMUT;

    申请日1975-03-13

  • 分类号H05K7/20;H01L23/36;

  • 国家 DE

  • 入库时间 2022-08-23 02:02:04

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