Bright rhodium-rhenium alloy electrodeposition - from an acid plating bath contg. sulphamic acid, a buffer and a complex-forming agent

摘要

The electroplating bath comprises =10 g/l sulphamic acid, pref. 50-100 g/l; 0.1-15 g/l Rh, pref. 0.5-5 g/l; 0.2 g/l Re, pref. 100-200 mg/l; is not 100 cm3/l concn. H2SO4, and gives a bright Rh-Re alloy deposit contg. =70 pref. 85 wt.% Rh. Suitable for decorative applications, e.g. silver-ware and jewelry, and also for electronic contacts.