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SINGLE LAYER DOPED POLY-SILICON GATE STRUCTURE FOR CHARGE-COUPLED DEVICES

机译:电荷耦合器件的单层掺杂多晶硅栅结构

摘要

1528923 Charge-coupled devices RCA CORPORATION 19 Jan 1976 [3 Feb 1975] 4544/75 Heading H1K In a CCD comprising a single layer semiconductor gate structure preferably of polysilicon, on an insulated substrate 10, transfer electrodes 14, 16, 18 &c. are separated by regions 20, 22 of a conductivity type opposite to that of the electrodes, and in use the leakage current between adjacent electrodes is reduced by properly biasing the substrate relative to the electrodes. In case of a buried-channel device, Fig. 4 (not shown), the transfer electrodes are of the same conductivity type as the substrate provided with a thin layer of the opposite conductivity type in between the substrate and an insulating layer, e.g. of silicon dioxide. Diffusion regions, Fig. 5 (not shown), in the substrate, of the same conductivity type as but of higher impurity concentration than the substrate are provided to define the boundaries of the CCD channels. When used as a two-phase device, a fixed charge either in the insulation layer or in the substrate beneath the same edge of each electrode is provided. The polysilicon layer, preferably vapour deposited by pyrolitic decomposition of silane, is doped by using diborane during growth or subsequently by ion implanatation, whereas N+ regions are formed using an oxide diffusion mask and using conventional phosphorous doping sources. Aluminium is used for contacting the transfer electrodes. Upper and lower limits of three-phase voltage waveforms imposed on the electrodes and the bias voltage of the substrate are disclosed.
机译:1528923电荷耦合器件RCA CORPORATION 1976年1月19日[1975年2月3日] 4544/75标题H1K在包括优选为多晶硅的单层半导体栅极结构的CCD中,在绝缘基板10上具有转移电极14、16、18&c。通过与电极的导电类型相反的导电类型的区域20、22分隔开,并且在使用中,通过相对于电极适当地偏置基板来减小相邻电极之间的泄漏电流。在图4的埋入沟道器件的情况下(未示出),转移电极具有与基片相同的导电类型,在基片和绝缘层之间例如在基片和绝缘层之间具有相反导电类型的薄层。二氧化硅。提供基板中的图5的扩散区域(未示出),该扩散区域具有与基板相同的导电类型,但是杂质浓度高于基板,以限定CCD通道的边界。当用作两相设备时,可以在绝缘层中或在每个电极同一边缘下方的基板中提供固定电荷。多晶硅层,优选地通过硅烷的热解分解而气相沉积的多晶硅层,在生长过程中通过乙硼烷进行掺杂,或者随后通过离子浸渍法进行掺杂,而N +区域是通过使用氧化物扩散掩模并使用常规的磷掺杂源形成的。铝用于接触转移电极。公开了施加在电极上的三相电压波形的上限和下限以及基板的偏置电压。

著录项

  • 公开/公告号GB1528923A

    专利类型

  • 公开/公告日1978-10-18

    原文格式PDF

  • 申请/专利权人 RCA CORP;

    申请/专利号GB19750004544

  • 发明设计人

    申请日1975-02-03

  • 分类号H01L29/62;H01L29/78;

  • 国家 GB

  • 入库时间 2022-08-22 21:35:17

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