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Technique for contactless characterization of semiconducting material and device structures
Technique for contactless characterization of semiconducting material and device structures
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机译:半导体材料和器件结构的非接触表征技术
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摘要
This invention is directed to a device and method for measuring carrier mobility and density in thin-film semiconductor materials such as those used in thin-film circuitry, particularly in high- frequency microwave devices. The device includes a microwave system in combination with a variable magnetic field in which the material to be measured is positioned at an E-field maximum in a shorted section of waveguide, which shorted section is in the magnetic field. The magnetic- field dependence of the reflected power is then monitored. The carrier mobility is derived from the value of the magnetic field at the point at which the microwave power reflected from the material falls to one-half of the reflected microwave power when the magnetic field value is zero. The electron density may be determined from the change in amplitude of the signal between zero magnetic field and high fields by proper calibration.
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