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Technique for contactless characterization of semiconducting material and device structures

机译:半导体材料和器件结构的非接触表征技术

摘要

This invention is directed to a device and method for measuring carrier mobility and density in thin-film semiconductor materials such as those used in thin-film circuitry, particularly in high- frequency microwave devices. The device includes a microwave system in combination with a variable magnetic field in which the material to be measured is positioned at an E-field maximum in a shorted section of waveguide, which shorted section is in the magnetic field. The magnetic- field dependence of the reflected power is then monitored. The carrier mobility is derived from the value of the magnetic field at the point at which the microwave power reflected from the material falls to one-half of the reflected microwave power when the magnetic field value is zero. The electron density may be determined from the change in amplitude of the signal between zero magnetic field and high fields by proper calibration.
机译:本发明涉及一种用于测量薄膜半导体材料中的载流子迁移率和密度的设备和方法,所述薄膜半导体材料例如是薄膜电路中使用的那些,特别是在高频微波设备中。该装置包括与可变磁场结合的微波系统,其中待测材料在波导的短路段中位于电场的最大值处,该短路段位于磁场中。然后监测反射功率与磁场的关系。载流子迁移率是从磁场强度为零时从材料反射的微波功率下降到反射微波功率的一半时的磁场值得出的。可以通过适当的校准根据零磁场与高磁场之间的信号幅度变化来确定电子密度。

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