首页>
外国专利>
Metallised foams and embossing plates mfr. - by activating substrate with non-conductive hydrophilic composite material, electroless plating with conductive metal and electroplating
Metallised foams and embossing plates mfr. - by activating substrate with non-conductive hydrophilic composite material, electroless plating with conductive metal and electroplating
展开▼
机译:金属泡沫和压花板。 -通过用不导电的亲水复合材料激活基材,用导电金属进行化学镀和电镀
展开▼
页面导航
摘要
著录项
相似文献
摘要
A substrate is metallised by (a) coating a (textured) substrate with a non-conductive hydrophilic composite material (I) to a thickness of 0.05-5 mils; (b) electrolessly plating with a conductive metal; and (c) electroplating with the desired metal. Also claimed is a method where after step (c), the substrate (textured) is removed from the metal. (I) comprises =1 film forming component (A) and =1 water-insol. hydrophilic component (B), the weight ratio of A:B being 3:10 - 10:1 and being soluble in a solvent without phase sepn. The substrate is pref. a cellular, three-dimensional network of macroscopic, interconnected cells, esp. of a solid organic material, e.g. reticulated polyurethane foam. The textured substrate is pref. used to make an embossing plate. Method is used to form metallised foams or textured surfaces for use on embossing rolls, for embossing e.g. plastics or leather. The metallised foam prod. can be compressed to a desired filling factor for use in heat exchangers, regenerators, catalyst supports, battery plates electrodes, etc. Coating with composite material eliminates the need for cleaning and etching steps normal in prior art.
展开▼