首页> 外国专利> Metallised foams and embossing plates mfr. - by activating substrate with non-conductive hydrophilic composite material, electroless plating with conductive metal and electroplating

Metallised foams and embossing plates mfr. - by activating substrate with non-conductive hydrophilic composite material, electroless plating with conductive metal and electroplating

机译:金属泡沫和压花板。 -通过用不导电的亲水复合材料激活基材,用导电金属进行化学镀和电镀

摘要

A substrate is metallised by (a) coating a (textured) substrate with a non-conductive hydrophilic composite material (I) to a thickness of 0.05-5 mils; (b) electrolessly plating with a conductive metal; and (c) electroplating with the desired metal. Also claimed is a method where after step (c), the substrate (textured) is removed from the metal. (I) comprises =1 film forming component (A) and =1 water-insol. hydrophilic component (B), the weight ratio of A:B being 3:10 - 10:1 and being soluble in a solvent without phase sepn. The substrate is pref. a cellular, three-dimensional network of macroscopic, interconnected cells, esp. of a solid organic material, e.g. reticulated polyurethane foam. The textured substrate is pref. used to make an embossing plate. Method is used to form metallised foams or textured surfaces for use on embossing rolls, for embossing e.g. plastics or leather. The metallised foam prod. can be compressed to a desired filling factor for use in heat exchangers, regenerators, catalyst supports, battery plates electrodes, etc. Coating with composite material eliminates the need for cleaning and etching steps normal in prior art.
机译:通过(a)用不导电的亲水性复合材料(I)涂覆(带纹理的)基材至0.05-5密耳的厚度来对基材进行金属化; (b)用导电金属化学镀; (c)用所需的金属电镀。还要求保护一种方法,其中在步骤(c)之后,从金属上去除衬底(带纹理的)。 (I)包含> = 1的成膜组分(A)和> = 1的水溶胶。亲水性组分(B),A:B的重量比为3:10-10:1,可溶于溶剂而没有相分离。基材是优选的。宏观互连单元的蜂窝三维网络,尤其是。由固体有机材料制成网状聚氨酯泡沫。带纹理的基材是优选的。用于制作压花板。该方法用于形成金属化的泡沫或网纹表面,以用于压花辊,例如用于压花。塑料或皮革。金属化泡沫产品。可以将其压缩至用于热交换器,再生器,催化剂载体,电池极板电极等的所需填充因子。用复合材料涂覆消除了现有技术中常规的清洁和蚀刻步骤。

著录项

  • 公开/公告号FR2411902A1

    专利类型

  • 公开/公告日1979-07-13

    原文格式PDF

  • 申请/专利权人 STAUFFER CHEMICAL CY;

    申请/专利号FR19770038202

  • 发明设计人 MIGUEL COLL-PALAGOS;

    申请日1977-12-19

  • 分类号C25D5/56;C08J5/12;

  • 国家 FR

  • 入库时间 2022-08-22 19:31:47

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