PRODUCTION OF LEADDTINNSILVER ALLOY BASE SOLDER

摘要

PURPOSE:To obtain the solder which is capable of providing the bond part of superior mechanical characteristics and free from local deterioration and rupture by adding Sn and Ag components as stable Ag3Sn compound powder to Pb without separately adding these. CONSTITUTION:In the case of making the Pb-Sn-Ag alloy base solder, Sn and Ag components are added as Ag3Sn compound to Pb. Thence, this is heat treated at the decomposition temperature or less of the Ag3Sn compound to allow Ag3Sn compound to disperse. Here, it is desirable that the addition ratio of the Ag3Sn compound be made within a range of 2-5wt% based on the weight of Pb.