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SEMICONDUCTOR XXRAY DETECTOR FOR USE IN XXRAY EXPOSURE CONTROL DEVICE

机译:用于XX射线曝光控制设备的XX射线半导体探测器

摘要

PURPOSE:To prevent the shadow of the detector itself from appearing on the subsequent films by constituting specifically the thickness of an X-ray detecting element, the thickness of an electrode lead-out wire and the configuration of a mount base. CONSTITUTION:A semiconductor X-ray detecting element 41, is mounted on a mount base 44 formed in a substantially ring shape, and an electrode is fitted to cover its rear back surface. The X-ray detecting element 41 which is unitarily mounted on the mount base 44 is fitted and fixed in a hole formed in the stationary plate 42, and electrode lead out wires 431 and 432 are arranged. The thickness of the X-ray detecting element 41 is converted into 100-800mum in the terms of aluminum relating to the X-ray damping and electrode lead out wires 431 and 432 are formed by an aluminum film of 40mum or less of thickness. Furthermore, the outer peripheral part of the mount base 44, that is, the fitting part with the stationary plate 42 and its inner peripheral part thereof are tapered.
机译:目的:为防止检测器本身的阴影出现在随后的膜上,方法是专门构成X射线检测元件的厚度,电极引出线的厚度和安装底座的结构。构成:半导体X射线检测元件41安装在形成为大致环形的安装座44上,并且电极被安装以覆盖其后背面。一体地安装在安装基座44上的X射线检测元件41被安装并固定在形成在固定板42上的孔中,并且布置有电极引出线431和432。就与X射线衰减有关的铝而言,X射线检测元件41的厚度被转换为100-800μm,并且电极引出线431和432由厚度为40μm或更小的铝膜形成。另外,安装座44的外周部,即与固定板42的嵌合部及其内周部呈锥形。

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