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A method for determining of the offset between the conductor tracks and kontaktloechern in the case of a printed circuit board as well as a printed circuit board for use in this method
A method for determining of the offset between the conductor tracks and kontaktloechern in the case of a printed circuit board as well as a printed circuit board for use in this method
A conductor plate and a method for determining the offset between conductor paths and contact holes in the conductor plate. Conductor paths with contact eyes and at least one control mark are simultaneously applied, and, in a later step, contact holes and a control hole for each control mark are simultaneously punched through the conductor plate. Then the position of the control hole is determined relative to its associated control mark. The control mark has at least one curved control path which encloses, on at least one side, a control area of the conductor plate; the control hole is centrally located within the control area when the contact holes are centrally located within their associated contact eyes. Preferably, there are two control marks disposed diagonally opposite each other and pointing in different directions. Each control mark may comprise a group of control paths disposed within one another.
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