首页> 外国专利> Electron irradiation process of glass passivated semiconductor devices for improved reverse characteristics

Electron irradiation process of glass passivated semiconductor devices for improved reverse characteristics

机译:玻璃钝化半导体器件的电子辐照工艺可改善反向特性

摘要

Semiconductor devices with improved reverse characteristics are obtained by exposing the semiconductor bodies of the devices that are passivated by alkali-free glasses to a high energy radiation such as an electron radiation so as to shorten a life time of the bodies down to a predetermined value, while increasing the reverse leakage current of the bodies, and by subjecting the irradiated semiconductor bodies to an annealing treatment at a temperature of 250° to 350° C. for a sufficient time so as to decrease the reverse leakage current down to a predetermined value, while maintaining the order of the shortened life time.
机译:通过将被无碱玻璃钝化的器件的半导体本体暴露于高能辐射(如电子辐射),从而将这些本体的寿命缩短至预定值,可以获得具有改善的反向特性的半导体器件,在增加主体的反向漏电流的同时,通过对被照射的半导体主体在250°至350°C的温度下进行足够时间的退火处理,以将反向漏电流减小到预定值,同时保持缩短寿命的顺序。

著录项

  • 公开/公告号US4201598A

    专利类型

  • 公开/公告日1980-05-06

    原文格式PDF

  • 申请/专利权人 HITACHI LTD;

    申请/专利号US19770820698

  • 申请日1977-08-01

  • 分类号H01L7/54;H01L21/263;

  • 国家 US

  • 入库时间 2022-08-22 17:05:04

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号