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Copper chloride soln. for etching copper - contains alkali chloride as complex former to give increased etching rate
Copper chloride soln. for etching copper - contains alkali chloride as complex former to give increased etching rate
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机译:氯化铜溶液。用于蚀刻铜-包含碱金属氯化物作为络合物前体以提高蚀刻速率
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摘要
Cupric chloride soln. for etching copper additionally contains an alkali metal chloride (pref. potassium chloride) as a complex former. Pref. the soln. contains 130-320 (esp. 210) g/l cupric chloride and 70-250 (esp. 160) g/l potassium chloride. The soln. can be used in automatic machines for printed circuit board prodn. It gives a high etching rate, produces no hydrochloric acid mist or corrosion of the etching machine and can be regenerated simply using air.
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