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Anodic oxidn. appts. for silicon wafer - with tungsten wire reference electrode over wafer for controlled oxidn. of defect pn-junction

机译:阳极氧化。 Appts。用于硅晶片-钨丝参比电极位于晶片上方,用于受控氧化。 PN结的缺陷

摘要

Appts. for the anodic oxidn. of a Si wafer, which is made the anode in a cell (1) filled with electrolyte and having a noble metal cathode, also has a W wire (5) as reference electrode, which is placed over the Si wafer (3) and pref. ca. 1 mm from this. Pref. the W wire is (partly) coated with oxide. The Si wafer is placed on a metal or graphite plate (2) and is parallel to a Pt cathode. The appts. is specified for use in the anodic oxidn. of Si wafers with defect pn-junctions. Defect pn-junctions and transistors with low breakdown voltage or high leakage current can be oxidised selectively.
机译:Appts。用于阳极氧化。 Si晶片的一个电极是阳极(W)在填充电解质的电解槽(1)中具有贵金属阴极,还具有W线(5)作为参比电极,该电极放置在Si晶片(3)上, 。 ca.距此1毫米。首选W线(部分)涂有氧化物。将硅晶片放置在金属或石墨板(2)上,并平行于铂阴极。苹果。被指定用于阳极氧化。具有缺陷pn结的Si晶片的制造。具有低击穿电压或高泄漏电流的缺陷pn结和晶体管可以被选择性地氧化。

著录项

  • 公开/公告号DE2952157A1

    专利类型

  • 公开/公告日1981-06-25

    原文格式PDF

  • 申请/专利权人 IBM DEUTSCHLAND GMBH;

    申请/专利号DE19792952157

  • 发明设计人 SCHMITTDIPL.-PHYS.DR.ALFRED;

    申请日1979-12-22

  • 分类号C25D11/32;

  • 国家 DE

  • 入库时间 2022-08-22 15:13:21

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