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Method and apparatus for non-destructive testing of beam-lead integrated circuit connections
Method and apparatus for non-destructive testing of beam-lead integrated circuit connections
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机译:束引线集成电路连接的无损检测方法和装置
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摘要
A method and apparatus for non-destructive testing of beam- lead integrated circuit connections in which each of the leads from a chip beam-lead device has a pull tab made interval therewith with a weakened area and means for connecting a pull tool thereto to test the bond strength between the individual lead and the conductor to which the lead is bonded to determine if a predetermined bond exist between the lead and the conductor.
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