首页>
外国专利>
METHOD AND APPARATUS FOR REMOVING COPPER FROM COPPER CHLORIDE ETCHING SOLUTION AND REGENERATING SAID SOLUTION BY ELECTROLYSIS
METHOD AND APPARATUS FOR REMOVING COPPER FROM COPPER CHLORIDE ETCHING SOLUTION AND REGENERATING SAID SOLUTION BY ELECTROLYSIS
展开▼
机译:通过电解从氯化铜蚀刻溶液中去除铜并再生盐溶液的方法和装置
展开▼
页面导航
摘要
著录项
相似文献
摘要
PURPOSE:To easily separate and recover metallic copper from the surface of a cathode, when a waste copper chloride etching soln. is regenerated by an electrolytic method and metallic copper is deposited on the cathode, by adjusting the area and current density of the cathode to a specified range. CONSTITUTION:The etching power of a CuCl2 etching soln. used in a process of etching copper of a printed substrate or the like is reduced owing to an increase in the CuCl content as the soln. is used. So, the soln. is electrolyzed to deposit metallic copper on a cathode as well as chlorinate CuCl to CuCl2. At this time, the current density of the cathode is adjuted to 20-150A/cm2, and the area of the cathode is reduced to a half or less of that of an anode. By controlling the increase of the anode current density to a half or less of that of the cathode current density, polarization is inhibited to prevent the CuCl2 regeneration efficiency from lowering, and metallic copper is deposited on the cathode in the form of fine grains to easily separate and recover metallic copper from the cathode surface.
展开▼
机译:目的:当废氯化铜蚀刻液时,可轻松地从阴极表面分离和回收金属铜。通过将阴极的面积和电流密度调节到指定范围,可通过电解方法再生金属并在阴极上沉积金属铜。组成:CuCl2蚀刻液的蚀刻能力。由于作为溶液的CuCl含量的增加,减少了在蚀刻印刷基板等的铜的过程中使用的铜。用来。所以,索恩。进行电解以在阴极上沉积金属铜以及将氯化物CuCl生成CuCl2。此时,将阴极的电流密度调节至20-150A / cm 2,并且将阴极的面积减小至阳极的一半或更少。通过将阳极电流密度的增加控制为阴极电流密度的一半或更小,可以抑制极化,防止CuCl2再生效率降低,并且金属铜以细晶粒的形式沉积在阴极上,从而很容易从阴极表面分离并回收金属铜。
展开▼