ELECTROLESS COPPER DEPOSITION SOLUTION USING A HYPOPHOSPHITE REDUCING AGENT

摘要

ABSTRACTElectroless copper deposition solutions, and method ofelectrolessly depositing copper onto a suitably catalysed andgenerally non-conductive workpiece surface using these solutions,are disclosed. The solutions contain, in addition to water asthe usual solvent, a soluble source of copper ions, a complexingagent or mixture of agents to maintain the copper in solution,and a copper reducing agent effective to reduce the copper ionsto metallic copper as a deposit or plating on a prepared surfaceof a workpiece brought into contact with solution. The reduc-ing agent is a soluble source of hypophosphite ions and thecomplexing agent is selected to be effective at pH level between5 and 13 for complexing cupric ions and the solution pH is co-ordinated within the pH range for the complexer selected to givea deposited conductive copper film.