首页> 外国专利> Wireless chip resistor, using thin alloy film on polyimide foil - esp. for use in automatic machines fixing the resistors on printed circuit boards

Wireless chip resistor, using thin alloy film on polyimide foil - esp. for use in automatic machines fixing the resistors on printed circuit boards

机译:无线芯片电阻器,在聚酰亚胺箔上使用合金薄膜-特别是。用于自动机器,将电阻器固定在印刷电路板上

摘要

A polyimide substrate foil is coated with an NiCr resistor film which may be calibrated to obtain a desired resistance value. The resistor film is provided with thicker contact zones; and both the film and the zones are covered with an adhesive which bonds a covering polyimide foil contg. holes for solderable electric contacts. The chip resistor is pref. made by evaporating an NiCrCu film onto a substrate foil strip, then thickening the Cu film electrolytically in local contact zones. Photo-etching is then used to shape the resistor film and contacts; and a laser is used to adjust the resistance value. A very simple design permitting easy mass prodn. and possessing high mechanical stability.
机译:聚酰亚胺衬底箔上涂有一层NiCr电阻膜,可以对其进行校准以获得所需的电阻值。电阻膜具有较厚的接触区。薄膜和区域均被粘合剂覆盖,该粘合剂粘合覆盖的聚酰亚胺箔。用于可焊接电触点的孔。片式电阻器为首选。通过将NiCrCu膜蒸发到基底箔带上,然后在局部接触区域电解使Cu膜增厚来制备。然后使用光刻法对电阻膜和触点进行整形。用激光调节电阻值。非常简单的设计,易于批量生产。并具有较高的机械稳定性。

著录项

  • 公开/公告号DE3023133A1

    专利类型

  • 公开/公告日1982-01-07

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE19803023133

  • 发明设计人 KAUSCHEHELMOLDDIPL.-PHYS.;

    申请日1980-06-20

  • 分类号H01C7/00;

  • 国家 DE

  • 入库时间 2022-08-22 12:43:34

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