首页> 外国专利> Alloyed metal contact prodn. on oriented semiconductor crystal - by rastering surface with intense pulsed laser light before applying metal assists alloying

Alloyed metal contact prodn. on oriented semiconductor crystal - by rastering surface with intense pulsed laser light before applying metal assists alloying

机译:合金金属触点产品在定向的半导体晶体上-通过在施加金属辅助合金化之前用强脉冲激光光栅化表面

摘要

In the prodn. of alloyed metal contact layers on crystal-oriented semiconductor surfaces by energy pulse radiation, the intended area of the semiconductor surface is first rastered with a close sequence of intensive laser light pulses. Then the metal layer is applied and alloyed with the semiconductor surface in conventional manner. The process is used on (100) oriented Si crystals used for the prodn. of transistors, esp. thyristors contg. controllable short circuits produced by integrated FETs. Pretreatment favours alloying and the formation of alloy layers of uniform thickness.
机译:在产品中在通过能量脉冲辐射对晶体取向的半导体表面上的合金化金属接触层进行第一层处理之后,首先用紧密的密集激光脉冲序列来光栅化半导体表面的预期区域。然后以常规方式施加金属层并使其与半导体表面合金化。该工艺用于产品的(100)取向的Si晶体。的晶体管,特别是晶闸管续集成FET产生的可控短路。预处理有利于合金化和形成厚度均匀的合金层。

著录项

  • 公开/公告号DE3045784A1

    专利类型

  • 公开/公告日1982-07-08

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE19803045784

  • 发明设计人 PATALONGHUBERTDR.;F.DR. KRIMMELEBERHARD;

    申请日1980-12-04

  • 分类号H01L21/24;

  • 国家 DE

  • 入库时间 2022-08-22 12:40:53

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