Semiconductor device cooling structure - includes finned base with slots for contact strips, and securing bolts holding device across them

摘要

The cooling system for a semiconductor device uses a heat dissipating base (1) with a smooth top surface (2) and cooling fins (8) underneath. The top surface also includes longitudinal grooves (3,4,5) into which slide heat transfer strips (9,10) which are channel shaped in sections with one end (15) bent downwards to act as a stop against the end of the base. Bolts (14,16) which are inserted through holes between the ribs and through the strips, have threaded stems (17,18) which screw into the semiconductor device. Their heads are prevented from rotating by the ribs which contact their sides. Lock nuts (28) are fitted.