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Process for the preliminary heating of semiconductor bodies in view of subsequently increasing their internal gettering effect

机译:鉴于随后增加其内部吸杂效果而对半导体本体进行初步加热的方法

摘要

The gettering effect in the bulk of semiconductor bodies is increased by heating the bodies prior to device processing to a temperature of from 750 DEG -900 DEG C. for from 1-8 hours in order to generate oxygen precipitates in the form of clusters.
机译:通过在器件加工之前将半导体本体加热到750℃-900℃的温度1-8小时,以提高其在半导体本体中的吸杂效果,从而产生簇状的氧沉淀。

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