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aqueous, acid bath for the galvanic deposition of gold and method for galvanic deposition of hartgold in its use
aqueous, acid bath for the galvanic deposition of gold and method for galvanic deposition of hartgold in its use
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机译:用于金的电沉积的水性酸浴以及使用中的哈特金的电沉积方法
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摘要
A bath for electroplating hard gold deposits at relatively high current efficiencies comprises an aqueous solution of an alkali metal dihydrogen phosphate, nitrilotris(methylene) triphosphonic acid, a nickel and/or cobalt phosphate compound, triethanolamine borate, alkali metal gold cyanide and a small amount of free alkali metal cyanide. The bath is maintained at a pH of 3.8-4.5 and operated at a current density of 0.1-20 amperes per square decimeter.
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