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aqueous, acid bath for the galvanic deposition of gold and method for galvanic deposition of hartgold in its use

机译:用于金的电沉积的水性酸浴以及使用中的哈特金的电沉积方法

摘要

A bath for electroplating hard gold deposits at relatively high current efficiencies comprises an aqueous solution of an alkali metal dihydrogen phosphate, nitrilotris(methylene) triphosphonic acid, a nickel and/or cobalt phosphate compound, triethanolamine borate, alkali metal gold cyanide and a small amount of free alkali metal cyanide. The bath is maintained at a pH of 3.8-4.5 and operated at a current density of 0.1-20 amperes per square decimeter.
机译:用于以较高电流效率电镀硬金沉积物的镀液,包括碱金属磷酸二氢盐,次氮基三(亚甲基)三膦酸,镍和/或磷酸钴化合物,三乙醇胺硼酸盐,碱金属氰化金的水溶液。游离碱金属氰化物。该浴液的pH值保持在3.8-4.5,并在每平方分米0.1-20安培的电流密度下运行。

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