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Polycrystalline diamond and cemented carbide substrate and synthesizing process therefor

机译:多晶金刚石和硬质合金基体及其合成方法

摘要

A polycrystalline diamond body infiltrated by a silicon atom- containing metal (e.g., silicon alloy) is bonded to a substrate comprising cemented carbide with a barrier of refractory material extending between the diamonds cemented together with silicon atom- containing binder and the substrate substantially precluding migration of the cementing medium (e.g., cobalt) from the carbide substrate into contact with the silicon atom-containing bonding medium in the diamond body. The process comprises subjecting a mass of diamond powder, a quantity of silicon atom-containing metal binder material, a cemented carbide body and a barrier made of material selected from the group consisting of tantalum, vanadium, molybdenum, zirconium, tungsten and alloys thereof to the simultaneous application of elevated temperature and pressure.
机译:将由含硅原子的金属(例如硅合金)浸润的多晶金刚石体粘结到包括硬质合金的基底上,难熔材料的屏障在与含硅原子的粘结剂一起粘结的金刚石与基底之间基本上不迁移使碳化物基质中的胶结介质(例如钴)与金刚石主体中的含硅原子的键合介质接触。该方法包括使一定量的金刚石粉,一定量的含硅原子的金属粘合剂材料,硬质合金体和由选自钽,钒,钼,锆,钨及其合金的材料制成的阻挡层经受同时施加高温和高压。

著录项

  • 公开/公告号US4380471A

    专利类型

  • 公开/公告日1983-04-19

    原文格式PDF

  • 申请/专利权人 GENERAL ELECTRIC COMPANY;

    申请/专利号US19810222812

  • 申请日1981-01-05

  • 分类号B22F3/14;B22F7/00;C04B31/16;

  • 国家 US

  • 入库时间 2022-08-22 09:51:03

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