首页> 外国专利> ELIMINATION PROCESS OF CRYSTAL DEFECTS PRODUCED IN N-TYPE LAYERS OF A SILICON SEMICONDUCTOR DEVICE BY PHOSPHORUS ION IMPLANTATION AND DEVICE PRODUCED BY THIS METHOD

ELIMINATION PROCESS OF CRYSTAL DEFECTS PRODUCED IN N-TYPE LAYERS OF A SILICON SEMICONDUCTOR DEVICE BY PHOSPHORUS ION IMPLANTATION AND DEVICE PRODUCED BY THIS METHOD

机译:磷离子注入及通过该方法生产的器件消除了硅半导体器件N型层中产生的晶体缺陷的过程

摘要

The invention relates to a semiconductor device and to a method of fully eliminating lattice defects in N-conductive zones of a semiconductor device which are generated by ion implantation of phosphorus. According to the invention, conductivity-determining ions like antimony or arsenic are implanted into phosphorus-doped zones of a semi-conductor device. A dosage of 1 to 10% of the phosphorus dose is used. The implantation of the antimony or arsenic takes place with the same, or with a greater implantation depth than the phosphorus depth. Subsequent to the antimony/arsenic implantation the device is annealed in an inert gas atmosphere at approximately 1000 DEG C.
机译:半导体器件和方法技术领域本发明涉及一种半导体器件以及一种完全消除由于磷离子注入而在半导体器件的N导电区中引起的晶格缺陷的方法。根据本发明,将诸如锑或砷之类的确定电导率的离子注入半导体器件的磷掺杂区中。使用磷剂量的1至10%的剂量。锑或砷的注入以相同或更大的深度进行。锑/砷注入之后,将器件在惰性气体气氛中于大约1000℃退火。

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