A process for preparing a composition suitable for Molding, including encapsulation Molding articles and suitable to be printed by Laser Molded in a State

摘要

Method for preparing compositions suitable for Molding, which has applications for the encapsulation Molding articles and suitable to be printed by Laser once Moulded.Mix and smelt the mixture of Poly (arylene SULFIDE) and at least one Compound printing; injecting the Molten composition around the article to Encapsulate, Cool the composition around the article, solidify and Printed by Laser Surface material.tiene to Interpretations for the manufacture of Circuits and Electric Elements.