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METAL OXIDE THIN FILM GAS SENSOR ELEMENT

机译:金属氧化物薄膜气敏元件

摘要

PURPOSE:To obtain a uniform performance sensor with a high sensitivity dispensing with any doping process, by using an evaporation material source of metal or metal oxide to form an evaporation layer having a specified crystal orientation property with respect to the interface to contact a vapor phase. CONSTITUTION:After an oxide insulation layer 3 such as SiO2 is formed on the surface of Si or the like as substrate 1, a metal oxide thin film semiconductor layer 5 is to be formed by physical evaporation method or chemical evaporation method. The evaporation material source herein use shall be metal such as Sn, Zn and the like or the oxide thereof. Then, when the semiconductor layer 5 is formed under a specified condition depending on the material of the substrate 1, type of the evaporation material source, evaporation method and the like, the layer 5 is formed having a specified crystal orientation property with respect to the interface to contact a gaseous phase. For example, when the intensity of diffracted X rays as obtained when CuK as ray source is subjected to an X rays diffraction is I1-I4 sequentially, the ray intensity on (211) face and (110) face will be the highest. This enables the formation of the semiconductor layer 5 to meet a specified requirement of I2/I1=0.6 as well as half power width of I1 exceeding 0.58 and the like.
机译:用途:通过使用金属或金属氧化物的蒸发材料源形成相对于接触气相的界面具有指定晶体取向特性的蒸发层,从而获得可通过任何掺杂工艺实现高灵敏度分配的均匀性能传感器。构成:在作为衬底1的Si等表面上形成诸如SiO2的氧化物绝缘层3之后,将通过物理蒸发法或化学蒸发法形成金属氧化物薄膜半导体层5。本文使用的蒸发材料源应为金属,如锡,锌等或其氧化物。然后,当根据衬底1的材料在特定条件下形成半导体层5时,形成蒸发层的材料,蒸发方法的种类,蒸发方法等,相对于衬底5,形成具有规定的晶体取向性的层5。接触气相的界面。例如,当当CuK作为射线源进行X射线衍射时获得的衍射X射线的强度依次为I1-I4时,(211)面和(110)面的射线强度最高。这使得半导体层5的形成能够满足I2 / I1 <= 0.6的特定要求以及超过0.58的I1的半功率宽度等。

著录项

  • 公开/公告号JPS61191954A

    专利类型

  • 公开/公告日1986-08-26

    原文格式PDF

  • 申请/专利权人 OSAKA GAS CO LTD;

    申请/专利号JP19850032228

  • 申请日1985-02-20

  • 分类号G01N27/12;

  • 国家 JP

  • 入库时间 2022-08-22 07:48:03

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