CARRIER MECHANISM, CARRYING METHOD, SOLDER TREATMENT USING SAID MECHANISM, AND SOLDER PROCESSOR USING THE SAME

摘要

PURPOSE:To readily carry objects to be carried with different dimensions, by a method wherein rails assisting the carriage of objects to be carried are provided with the first guide which guides said objects from the lateral direction to the carriage direction and the second guide which guides the objects from above, which guides are used properly. CONSTITUTION:Rails 6 are provided with projections 7 on both sides in the longitudinal direction and loaded with semiconductor devices, thus assisting their carriage. The first guides 8 have the longitudinal direction on both sides of the longitudinal direction of the rails 6 and are arranged at required intervals. This first guide 8 guides the carriage of semiconductor devices. The second guides 9 are installed to the first guides 8. The semiconductor device 11 is the DIP TYPE whose leads 13 project out of the side surfaces of a package 12 in the longitudinal direction, and is guided along the top of the package 12 by the projection 10 of the second guide 9, then carried without fall out of the rails 6.