method for picking up the film of copper on printed circuit cards of wafers, with recovery by electrolysis of copper contained in the caustic solution

摘要

method for picking up copper films on wafers by use of printed circuit boards in a solution of copper sulfate of ammonia.after the caustic solution contains a substance containing bromine as the catalyst to increase the speed of attack, or picking up.in particular, the nh4br or ch3chbrcobr.the caustic solution allows for the electrolytic separation of ductile copper according to a coherent layer, easily detachable special steel electrodes.