A method for encapsulating an electrical component to pro- vide resistance to corona discharge

摘要

A highly fluid, solventless heat curable resin is formulated from an admixture comprising a polyglycidyl aromatic amine, a polycarboxylic acid anhydride curing agent, and a curing accelerator. The heat curable formulation exhibits low viscosity and is useful as an encapsulant and insulation for electrical members exposed to high electrical stress. Magnetic coils encapsulated with the cured formulation resist corona discharge at electrical stresses in excess of 2100 volts per mil.