A method for Encapsulating an electrical Component to provide resistance to corona Discharge Plasma

摘要

Method for Encapsulating an electrical component that provides resistance to corona discharge by using poliepoxidicas compositions and Heat Curing.The electrical component is impregnated with a Low Viscosity termocurable composition comprising an Aromatic Amine poliglicidilica uncured selected among diglicidilanilina, diglicidilortotoluidina, tetraglicidilmetaxililendiamina and mixtures thereof, a Curing Agent Policarboxilico of acid anhydride Curing Agent and Accelerator,Selected from a - Born anhydride Methyl methyltetrahydrophthalic anhydride and metilhexahidroftalico anhydride; and Curing the composition to form a layer of encapsulant on the electric component.