A field effect transistor, of vertical structure a submicron scale, and its advantages of

摘要

The invention relates to a vertical field effect transistor operating under ballistic conditions at very high frequencies (100-200 GHz). In order to increase the output impedance of this transistor, as well as its power, the field effect of the first gate is decoupled from the drain by the field effect of a second gate. The two gates are carried by two opposite sides of a mesa etched in the active layer beneath the drain. The second gate is displaced with respect to the first gate and is closer to the drain. The displacement is obtained by an insulating layer beneath the second gate. The two gates are successively deposited by lateral projections. Application to ultra-high frequency systems.